| 发明名称 |
PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART |
| 摘要 |
<p>A photosensitive adhesive composition comprising (A) polyimide of 80 to 180 mg/KOH acid value having carboxyl as a side chain, (B) radiation-polymerizable compound and (C) photopolymerization initiator.</p> |
| 申请公布号 |
KR20080016927(A) |
申请公布日期 |
2008.02.22 |
| 申请号 |
KR20087000038 |
申请日期 |
2006.06.30 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
KAWAMORI TAKASHI;MASUKO TAKASHI;KATOGI SHIGEKI;YASUDA MASAAKI |
| 分类号 |
C09J179/08;C09J7/00;C09J7/02 |
主分类号 |
C09J179/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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