发明名称 半導体装置
摘要 A semiconductor device having excellent electric characteristics and a method for manufacturing the semiconductor device are provided. A method for manufacturing a semiconductor device includes the steps of: forming a gate electrode; forming a gate insulating film to cover the gate electrode; forming an oxide semiconductor film over the gate insulating film; forming a hydrogen permeable film over the oxide semiconductor film; forming a hydrogen capture film over the hydrogen permeable film; performing heat treatment to release hydrogen from the oxide semiconductor film; forming a source electrode and a drain electrode to be in contact with a part of the oxide semiconductor film; and removing an exposed portion of the hydrogen capture film to form a channel protective film formed of the hydrogen permeable film. A semiconductor device manufactured by the above method is also provided.
申请公布号 JP6006511(B2) 申请公布日期 2016.10.12
申请号 JP20120062928 申请日期 2012.03.20
申请人 株式会社半導体エネルギー研究所 发明人 井本 裕己;丸山 哲紀;遠藤 佑太
分类号 H01L21/336;C23C14/06;C23C14/08;G02F1/1368;H01L21/26;H01L21/316;H01L21/318;H01L21/363;H01L21/8242;H01L27/10;H01L27/108;H01L29/786 主分类号 H01L21/336
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