| 摘要 |
PROBLEM TO BE SOLVED: To provide: a method of attaching a coverlay by which a twist of wires is prevented, and an obtained high-frequency circuit board has a sufficient adhesive strength, and no new manufacturing facility separated from an existing coverlay processing facility is required, in the case that a fluorine resin is used for the coverlay whose base material is a polyimide film; a high-frequency circuit board using a fluorine resin for a coverlay whose base material is a polyimide film and having a sufficient adhesive strength; and a coverlay for the high-frequency circuit board.SOLUTION: In a method of attaching a coverlay, a fluorine resin side of a coverlay consisting of a polyimide film layer and a fluorine resin layer is laminated so as to be contacted with a circuit of a copper clad lamination body, and the coverlay and the copper clad lamination body are temporally fixed. An adhesive strength between the polyimide film layer and the fluorine resin layer of the coverlay before the lamination is 3.0 N/cm or less. Annealing processing is performed to increase an adhesion force of a high-frequency circuit board after the annealing processing into 30 times or more of that before the annealing processing. |
