发明名称 METHOD OF MANUFACTURING A MEDICAL DEVICE HAVING A FEEDTHROUGH
摘要 A method of manufacturing an implantable medical device includes manufacturing a hermetic feedthrough by providing a first sheet of unfired ceramic material, forming one or more holes through the sheet, inserting a first conductive material into one of the holes, and forming a pad in electrical contact with the first conductive material in one of the holes, wherein the pad comprises a plurality of layers and has a thickness of at least 50 micrometers, at least one layer comprising a second conductive material having a different composition than the first conductive material. The method further includes co-firing the unfired ceramic material, the first conductive material, and the second conductive material. The method further includes coupling the feedthrough to an encasement structure of the implantable medical device.
申请公布号 US2016317821(A1) 申请公布日期 2016.11.03
申请号 US201615207649 申请日期 2016.07.12
申请人 Medtronic, Inc. ;Kyocera Corporation 发明人 Morioka Kengo;Fujii Keiichi;Knudsen Arne;Satou Shingo;Otomaru Hidekazu;Makino Hiroshi;Thom Andrew;Reiterer Markus;Munns Gordon;Miltich Thomas;Yamamoto Joyce
分类号 A61N1/375;H05K1/09;H05K1/03;H05K3/40;H05K1/11;H05K3/00 主分类号 A61N1/375
代理机构 代理人
主权项 1. A method of manufacturing an implantable medical device comprising: manufacturing a hermetic feedthrough comprising: providing a first sheet of unfired ceramic material;forming one or more holes through the sheet;inserting a first conductive material into one of the holes; andforming a pad in electrical contact with the first conductive material in one of the holes, wherein the pad comprises a plurality of layers and has a thickness of at least 50 micrometers, at least one layer comprising a second conductive material having a different composition than the first conductive material; co-firing the unfired ceramic material, the first conductive material, and the second conductive material; and coupling the feedthrough to an encasement structure of the implantable medical device.
地址 Minneapolis MN US