发明名称 |
METHOD OF MANUFACTURING A MEDICAL DEVICE HAVING A FEEDTHROUGH |
摘要 |
A method of manufacturing an implantable medical device includes manufacturing a hermetic feedthrough by providing a first sheet of unfired ceramic material, forming one or more holes through the sheet, inserting a first conductive material into one of the holes, and forming a pad in electrical contact with the first conductive material in one of the holes, wherein the pad comprises a plurality of layers and has a thickness of at least 50 micrometers, at least one layer comprising a second conductive material having a different composition than the first conductive material. The method further includes co-firing the unfired ceramic material, the first conductive material, and the second conductive material. The method further includes coupling the feedthrough to an encasement structure of the implantable medical device. |
申请公布号 |
US2016317821(A1) |
申请公布日期 |
2016.11.03 |
申请号 |
US201615207649 |
申请日期 |
2016.07.12 |
申请人 |
Medtronic, Inc. ;Kyocera Corporation |
发明人 |
Morioka Kengo;Fujii Keiichi;Knudsen Arne;Satou Shingo;Otomaru Hidekazu;Makino Hiroshi;Thom Andrew;Reiterer Markus;Munns Gordon;Miltich Thomas;Yamamoto Joyce |
分类号 |
A61N1/375;H05K1/09;H05K1/03;H05K3/40;H05K1/11;H05K3/00 |
主分类号 |
A61N1/375 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing an implantable medical device comprising:
manufacturing a hermetic feedthrough comprising:
providing a first sheet of unfired ceramic material;forming one or more holes through the sheet;inserting a first conductive material into one of the holes; andforming a pad in electrical contact with the first conductive material in one of the holes, wherein the pad comprises a plurality of layers and has a thickness of at least 50 micrometers, at least one layer comprising a second conductive material having a different composition than the first conductive material; co-firing the unfired ceramic material, the first conductive material, and the second conductive material; and coupling the feedthrough to an encasement structure of the implantable medical device. |
地址 |
Minneapolis MN US |