| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for a solder resist, which is suitably used for forming a solder resist layer that has high light-reflecting property, less likely degrades by light and has high moisture resistance and plating durability.SOLUTION: The resin composition for a solder resist comprises a base resin having a carboxyl group, an epoxy resin, and titanium oxide. The epoxy resin comprises a specific epoxy resin; and the specific epoxy resin has an aromatic ring, has 3 or less double bonds in π-electron conjugate systems including the aromatic ring, has no structure having two π-electron conjugate systems including the aromatic ring bonded by a single bond via a single carbon atom, and has neither nitrogen atom nor sulfur atom. The content of titanium oxide is in the range of 5 to 80 mass% with respect to the total solid content in the resin composition for a solder resist.SELECTED DRAWING: None |
