| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer ceramic electronic component capable of remarkably improving connection reliability of an external electrode to a conductor pad or a conductor via.SOLUTION: An external electrode production process in a manufacturing method of a multilayer ceramic capacitor includes the steps of: producing an unburnt multilayer chip UBC in which a pattern portion 15b1 for sneak foundation conductor layer is present in an end of an unburnt multilayer chip body UBCa at one side in a height direction while being covered by a burning-off sheet portion 15a1 and a pattern portion 14b1 for sneak foundation conductor layer is present in an end portion at the other side in the height direction while being exposed; burning off the burning-off sheet portion 15a1 by burning the unburnt multilayer chip UBC, and producing a burnt chip BC in which a sneak foundation conductor layer 25 is present in an end of a burnt chip body 21 at one side in a height direction while being exposed and a sneak foundation conductor layer 24 is present in an end at the other side in the height direction while being exposed.SELECTED DRAWING: Figure 4 |
