Semiconductor device having seal ring

摘要

A semiconductor device includes a thermal conductor formed on and thermally connected to the seal ring. The thermal conductor is spatially spaced from the electrically conductive pad. The thermal conductor is exposed of the substrate and can be regarded as an extension of the thermal path of the seal ring, such that the heat from the seal ring is dissipated efficiently.

主权项

1. A semiconductor device comprising:
a first substrate; at least one dielectric layer present on the first substrate; at least one first seal ring present in the dielectric layer; a second substrate present on the dielectric layer; at least one first thermal conductor present in the second substrate and thermally connected to the first seal ring, wherein the first thermal conductor is exposed from a surface of the second substrate; at least one second seal ring present in the dielectric layer, wherein the first seal ring is surrounded by the second seal ring; and at least one second thermal conductor present in the second substrate and thermally connected to the second seal ring, wherein the second thermal conductor is exposed from the surface of the second substrate, the first thermal conductor comprises an opening, and the second thermal conductor is continuous.