| 摘要 |
PURPOSE:To eliminate a fear of deformation, a crack and to form in a light weight by mounting a heat sink having a thermal expansion coefficient equivalent to that of a printed circuit board on the board. CONSTITUTION:A heat sink 2 is adhesively mounted on the lower surface of a printed circuit board 1 with adhesive while fitting a mounting protrusion 12 in the cavity 11 of the board 1. As the sink 2, a heat sink which has a thermal expansion coefficient equivalent to that of the board 1, a core of a resin laminated board 3, and a metal-plated layer 4 formed on the entire outer surface, is employed. |
