发明名称
摘要 PURPOSE:To make it possible to heat-insulate an ashing device from its surround ing devices at low cost without using a special cooling unit by a method wherein part of a placing stand, on which a substrate to be treated is placed, is provided with a mechanism having a heat insulation effect except the contact part of the placing stand with the above substrate to be treated. CONSTITUTION:An ashing device is a device for performing an ashing treatment on a substrate 14 to be treated provided on a placing stand 12 with ashing gas and at least part of the stand 12 is provided with a mechanism 13 having a heat insulation effect except the contact part 14 of the stand 12 with the substrate to be treated. For example, the mechanism having a heat insulation effect, heat insulating material 13 made of mylonite B, is provided at least part it the stand 12, such as the side port of the bottom part of the stand 12, except the contact part of the stand 12 with the substrate to be treated. There by, the ashing device can be heat-insulated from its surrounding devices at low cost without using a special cooling unit and the whole ashing device can be constituted in a compact size.
申请公布号 JPH06103665(B2) 申请公布日期 1994.12.14
申请号 JP19870148488 申请日期 1987.06.15
申请人 发明人
分类号 H01L21/302;G03F7/00;G03F7/30;G03F7/42;H01L21/027;H01L21/30;H01L21/3065;(IPC1-7):H01L21/027 主分类号 H01L21/302
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