| 摘要 |
PURPOSE:To surely remove polished chips by a method wherein a required heat-treatment process is executed between two prescribed processes. CONSTITUTION:When a sintering process, a surface polishing process and a cleaning process are executed sequentially, polished chips 7 are left in a bore 4 formed in a via 2 of a ceramic board main body 1. When a heat-treatment process to heat the main body 1 in an inert gas 10 is executed between the cleaning process and a thin-film formation process used to form a surface pattern 11 on the surface, the polished chips is removed surely. It is possible to prevent a conductor pattern from being oxidized, corroded or stripped off. The connection reliability between the ceramic board main body and the conductor pattern is enhanced. |
