| 摘要 |
Encapsulant material is applied to a component on a printed circuit 12, 13 by means of a stencil, conveniently in a screen printing process, to enable a known and repeatable quantity of encapsulant material to be deposited in order to minimize the thickness of the overall device. As well as the amount of material deposited a gasket 16 on the substrate 12 of the printed circuit can be used to control the spread of encapsulant on compression by a capping member for the encapsulant prior to curing. <IMAGE> |
