发明名称 LIQUID RESIN COMPOSITION FOR FRAME FOR STOPPING FLOW AND SEMICONDUCTOR DEVICE MADE BY USING IT
摘要 <p>PROBLEM TO BE SOLVED: To obtain a liquid resin composition used for a frame for stopping the flow of a liquid sealing resin composition and having good workability in application and good shape retentivity, with excellent long-term stability thereof. SOLUTION: This liquid resin composition consists of a liquid epoxy resin (A), a curing agent (B), a silica (C) having a mean particle diameter of primary particles of 2-50nm, with silanol groups on the surface, and comprising a hydrophobic silica obtained by reacting at least 50% of the silanol groups of silica with an organic compound of the formula, Si(R)m (X)n (wherein R is CH3 , C2 H5 , C4 H9 or C8 H17 ; X is Cl, Br, OCH3 or OH; and m+n=4), and an inorganic filler (D), wherein the component C accounts for 1-5wt.% of the total resin composition.</p>
申请公布号 JPH10130470(A) 申请公布日期 1998.05.19
申请号 JP19960284926 申请日期 1996.10.28
申请人 SUMITOMO BAKELITE CO LTD 发明人 OKUBO HIKARI;MURAYAMA RYUICHI;MATSUDA YUTAKA;TAKEDA TOSHIRO
分类号 C08K3/36;C08K9/06;C08L63/00;C09C1/28;C09C3/12;H01L21/56;H01L23/28;H01L23/29;H01L23/31;(IPC1-7):C08L63/00 主分类号 C08K3/36
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