发明名称
摘要 <p>PURPOSE:To omit the return of a wiring and to decrease the invalid areas and the disconnections of the wiring by providing the insulated and covered conductor lines among their plural opposite conductive patterns formed at the side parts of a transparent plate and forming an orthogonal wiring network on the transparent plate. CONSTITUTION:The plural conductive patterns 2 are formed at four side parts of a transparent glass plate 1 of a digitizer sensor plate 100. Then, the insulated and covered conductor lines 3 are provided among their opposite patterns 2 to form an orthogonal wiring network on the transparent glass plate 1. Furthermore, a soldering resist film 6 is formed at the side parts of the plate 1 except the parts where the lines 3 are soldered. That is, the film 6 is printed at the side parts of the plate 1 excluding the parts of the patterns 2 to be soldered with the lines 3 and also the parts of the patterns 2 which are soldered with the external lead wires. For instance, the soldering resist paste (preferably the colored glass of a low fusing point, the colored polymer, etc.) is screen- printed in a prescribed pattern.</p>
申请公布号 JP2857813(B2) 申请公布日期 1999.02.17
申请号 JP19920039056 申请日期 1992.02.26
申请人 TOKYO TOKUSHU DENSEN KK 发明人 SHIRAI MASAKATSU;GOTO SHIGEAKI;YAMAGUCHI TATSUO
分类号 G06F3/046;G06F3/03;G06F3/041;(IPC1-7):G06F3/03 主分类号 G06F3/046
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