METHOD OF MAKING A PRINTED CIRCUIT BOARD HAVING A TIN/LEAD COATING

摘要

A method of manufacturing a printed circuit board comprising a high density conductive pattern comprising at least one pad suitable for forming a solder connection with at least one surface mounted component. The method comprises the steps of forming the pattern; and forming a protective coating on the pattern suitable for soldering without solder resist adjacent the pad. The pad can adjoin land surrounding via hole, thereby increasing density of the circuit board layout. A further process for manufacturing printed circuits applies an etch resist to a conductive pattern, etches the pattern and uses the etch resist to form a protective coating on the pattern. The etch resist may be heated to cause the etch resist to form an alloy.