| 摘要 |
PROBLEM TO BE SOLVED: To obtain a light package for housing a semiconductor element which can keep a semiconductor element housed inside at a proper temperature and operate it normally and stably. SOLUTION: The package for housing a semiconductor element consists of a frame-like substrate 1, a heat sink 2 inserted in a hole part of the substrate 1, a frame-like wall member 3 fixed to an upper surface of the substrate 1 and a lid body 4 which closes an inside of the wall member 3. The substrate 1 is formed of aluminum oxide sintered body, aluminum nitride sintered body, silicon carbide sintering body and silicon nitride sintered body. The heat sink 2 is formed by applying a metallic layer with a three-layer structure of a bonding layer consisting of at least one kind of titanium, zirconium, vanadium or alloy mainly composed of them, an intermediate layer formed of copper, and a main layer formed of molybdenum, to both upper and lower surfaces of a core body 11 formed of unidirectional composite material wherein carbon fiber arranged in a thickness direction is coupled by carbon. |
