发明名称 REFLOW DEVICE FOR COMPONENT MOUNTING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To maintain the indoor air to heat at a temperature uniform on the whole and avoid the heated air from hitting a substrate which is a body to be heated with great force. SOLUTION: The reflow device for part mounting substrate comprises an outer cylinder 2 wherein an air inflow port 3 and an exhaust port 4 are provided respectively in the upper part and the lower part, and an inner cylinder 7 arranged in the outer cylinder 2 and attaching a sheath heater 8 which covers an outer whole circumference. While attaching an opening-and-closing door 12 in the opening of one side, the opening of the other side is blockaded with a blockade board 7a of the inner cylinder 7. A space S between the outer cylinder 2 and inner cylinder 7 is divided up and down by divider plates 11 and 11. In the inner cylinder 7, while covering all the circumferences and forming many long and slender vents 9 along the direction of an axis at predetermined intervals. Between each of the vents 9, a long and slender air turbulent flow board 10 of a predetermined length is stood up along each vent 9 in a doglegged shape in view of axial section. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006156621(A) 申请公布日期 2006.06.15
申请号 JP20040343520 申请日期 2004.11.29
申请人 MINAMI KK 发明人 MURAKAMI TAKEHIKO
分类号 H05K3/34 主分类号 H05K3/34
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