| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder alloy and a soldering method, in which the alloy is for an electrode connecting electronic components, free of lead, having fine texture, and superior resistance to thermal fatigue characteristics. SOLUTION: The solder alloy of an electrode for connecting electronic components consists essentially of Sn, Ag, and Cu, and the weight ratio for each component is 92 to 97 wt.% for Sn, 3.0 to 6.0 wt.% for Ag, and 0.1 to 2.0 wt.% for Cu. Addition of a small amount of Ag to the solder, consisting essentially of Sn, results in an alloy having a fine texture, reduced texture changes, and superior resistance to thermal fatigue. Addition of small amount of Cu improves the bonding strength by generating inter-metallic compounds. COPYRIGHT: (C)2008,JPO&INPIT
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