发明名称 METHOD FOR INSPECTING DEFECT OF IMAGING ELEMENT, AND DEFECT INSPECTION SUPPORTING PROGRAM
摘要 PROBLEM TO BE SOLVED: To simply and instinctively know the distribution and tendency of defects appearing on the whole semiconductor wafer on which a plurality of imaging elements are formed without requiring complicated operation. SOLUTION: Image data P, Q, R, S obtained from respective imaging elements 14 formed on a semiconductor wafer 16 are mapped on virtual positions corresponding to positions on the semicoductor wafer 16 to generate synthetic image data 18, and a synthetic image based on the synthetic image data 18 is displayed on a display device 11. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008028180(A) 申请公布日期 2008.02.07
申请号 JP20060199610 申请日期 2006.07.21
申请人 FUJIFILM CORP 发明人 IWABUCHI TOMOHITO
分类号 H01L21/66;G01R31/26;H01L27/14 主分类号 H01L21/66
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