| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor-manufacturing apparatus for miniaturizing a conveyance system for conveying a body to be conveyed and reducing the cost of manufacturing. SOLUTION: The semiconductor-manufacturing apparatus comprises a plurality of treatment units 30, having a delivery chamber 10 formed so that internal pressure can be adjusted, by installing a delivery robot 90 for receiving/delivering wafers via an opening inside, and a treatment chamber 31 for transferring wafers via the delivery robot 90, while being arranged adjacent to the delivery chamber 10; and an atmosphere conveyance robot 70 that travels to the position of the opening of the delivery chamber 10 of one of treatment units 30 and transfers the wafers to and from the delivery robot 90, arranged inside the delivery chamber 10. COPYRIGHT: (C)2008,JPO&INPIT
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