发明名称 Orthogonal backplane design with reduced chassis depth
摘要 According to some embodiments of the invention a device includes a first circuit board having a hollow slot, wherein a longitudinal length of the hollow slot is greater than a transverse length of the hollow slot, wherein a longitudinal axis of the hollow slot is parallel to a first edge of the first circuit board, wherein the hollow slot causes a gap at a second edge of the first circuit board, and wherein the hollow slot is adapted to accept a second circuit board that is oriented orthogonally to the first circuit board. The device may further include a first data transferring connector coupled to the first circuit board at a longitudinal terminus of the hollow slot, wherein the first data transferring connector is adapted to connect to a second data transferring connector that is coupled to the second circuit board.
申请公布号 US9362641(B2) 申请公布日期 2016.06.07
申请号 US201414321683 申请日期 2014.07.01
申请人 Telefonaktiebolaget L M Ericsson (publ) 发明人 Bachmutsky Alexander
分类号 H01R12/72;H01R12/73 主分类号 H01R12/72
代理机构 Nicholson De Vos Webster & Elliott, LLP 代理人 Nicholson De Vos Webster & Elliott, LLP
主权项 1. A device, comprising: a first circuit board having a hollow slot, wherein a longitudinal length of the hollow slot is greater than a transverse length of the hollow slot, wherein a longitudinal axis of the hollow slot is parallel to a first edge of the first circuit board, wherein the hollow slot causes a gap at a second edge of the first circuit board, and wherein the hollow slot is adapted to accept a second circuit board that is oriented orthogonally to the first circuit board; and a first data transferring connector coupled to the first circuit board at a longitudinal terminus of the hollow slot, wherein the first data transferring connector is adapted to connect to a second data transferring connector that is coupled to the second circuit board.
地址 Stockholm SE