发明名称 COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING SAME, AND CURRENT-CARRYING COMPONENT
摘要 A copper alloy sheet material contains, in mass %, Fe: 0.05 to 2.50%, Mg: 0.03 to 1.00%, and P: 0.01 to 0.20%, and the contents of these elements satisfy the relation Mg-1.18(P—Fe/3.6)3 0.03. The Mg solid-solution ratio determined by the amount of dissolved Mg (mass %)/the Mg content of the alloy (mass %)’ 100 is 50% or more. The density of an Fe—P-based compound having a particle size of 50 nm or more is 10.00 particles/10 mm2 or less, and the density of an Mg—P-based compound having a particle size of 100 nm or more is 10.00 particles/10 mm2 or less. The Cu—Fe—P—Mg-based copper alloy sheet material is excellent in terms of electrical conductivity, strength, bending workability, and stress relaxation resistance in the case where load stress is applied in a direction perpendicular to both a rolling direction and a sheet thickness direction.
申请公布号 US2016201179(A1) 申请公布日期 2016.07.14
申请号 US201414912641 申请日期 2014.08.26
申请人 DOWA METALTECH CO., LTD. 发明人 MIYAGI Kuniaki;SUGA Takashi;AOYAMA Tomotsugu;NARIEDA Hiroto;ENDO Hideki;SUGAWARA Akira
分类号 C22F1/08;C22C9/00;C22F1/00;C22C9/02 主分类号 C22F1/08
代理机构 代理人
主权项 1. A copper alloy sheet material comprising, in mass %, Fe: 0.05 to 2.50%, Mg: 0.03 to 1.00%, P: 0.01 to 0.20%, Sn: 0 to 0.50%, Ni: 0 to 0.30%, Zn: 0 to 0.30%, Si: 0 to 0.10%, Co: 0 to 0.10%, Cr: 0 to 0.10%, B: 0 to 0.10%, Zr: 0 to 0.10%, Ti: 0 to 0.10%, Mn: 0 to 0.10%, and V: 0 to 0.10%, the balance being Cu and inevitable impurities, and having a chemical composition that satisfies the following equation (1), the copper alloy sheet material being such that when the average Mg concentration (mass %) in a Cu matrix part determined by EDX analysis through TEM observation at a magnification of 100,000 is defined as the amount of dissolved Mg, the Mg solid-solution ratio defined by the following equation (2) is 50% or more, the density of an Fe—P-based compound having a particle size of 50 nm or more is 10.00 particles/10 μm2 or less, and the density of an Mg—P-based compound having a particle size of 100 nm or more is 10.00 particles/10 μm2 or less: Mg-1.18(P—Fe/3.6)≧0.03 . . .   (1)Mg solid-solution ratio(%)=the amount of dissolved Mg (mass %)/the total Mg content (mass %)×100 . . .   (2),wherein the element symbols Mg, P, and Fe in the equation (1) are substituted with the contents of the respective elements in mass %.
地址 Tokyo JP