| 发明名称 |
LEAD-FREE SOLDER HAVING LOW MELTING POINT |
| 摘要 |
According to the present invention, a lead-free solder having a low melting point comprises: 1.0-2.0 wt% of silver (Ag), 4.0-8.0 wt% of indium (In), 10.0-20.0 wt% of bismuth (Bi), 0.005-0.1 wt% of a deoxidizer, and the remainder consisting of tin (Sn). The melting point of the lead-free solder is 170-190 degree Celsius. |
| 申请公布号 |
KR20160107005(A) |
申请公布日期 |
2016.09.13 |
| 申请号 |
KR20150029851 |
申请日期 |
2015.03.03 |
| 申请人 |
MK ELECTRON CO., LTD. |
发明人 |
KIM, HUI JOONG;SONG, JAE HUN;LEE, YOUNG WOO;LEE, JAE HONG;SON, JAE YEOL;KIM, EUNG JAE;CHA, HO GUN |
| 分类号 |
B23K35/26 |
主分类号 |
B23K35/26 |
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