CARRIER FOR TEMPORARY BONDED WAFERS

摘要

A carrier is disclosed onto which a wafer can be temporarily bonded. The carrier comprises a plate shaped laminate. The plate shaped laminate comprises a first layer. The first layer comprises a foil, a sheet or a plate. The plate shaped laminate comprises a second layer. The second layer comprises a porous metal medium with three-dimensional open pores. The porous metal medium comprises metal fibers. The first layer is permanently bonded to the porous metal medium thereby closing the pores of the porous metal medium at the side where the first layer is located. The side edges of the porous metal medium are permanently sealed so that no open pores are present at the side edges of the porous metal medium.