Systems and methods for forming apertures in microfeature workpieces

摘要

Systems and methods for forming apertures in microfeature workpieces are disclosed herein. In one embodiment, a method includes directing a laser beam toward a microfeature workpiece to form an aperture and sensing the laser beam pass through the microfeature workpiece in real time. The method can further include determining a number of pulses of the laser beam and/or an elapsed time to form the aperture and controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a second aperture in the microfeature workpiece.

主权项

1. A method for forming an aperture in a microfeature workpiece, the method comprising:
positioning the microfeature workpiece between a laser and an electromagnetic radiation sensor; directing a laser beam from the laser toward the microfeature workpiece to form a first hole in the microfeature workpiece while the microfeature workpiece is positioned between the laser and the electromagnetic radiation sensor; determining a number of pulses of the laser beam and/or an elapsed time to form the first hole by sensing when the laser beam passes through the microfeature workpiece with the sensor; determining a desired depth for a second hole in the microfeature workpiece; and automatically controlling the laser beam to form a plurality of second holes based on the determined number of pulses and/or the determined elapsed time, a depth of the first hole, and the desired depth of the second hole.