发明名称 POWER SEMICONDUCTOR MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a power semiconductor module of which by reducing a partial discharge, the longer life of products becomes possible. <P>SOLUTION: The power semiconductor module according to the present invention comprises: a radiating plate 1; a circuit substrate 2 mounted on the radiating plate 1; a conductive pattern 10 provided on the circuit substrate 2; a low dielectric constant film 11 covering the conductive pattern 10; a case 7 provided on the radiating plate 1 covering the circuit substrate 2; and a flexible insulator 9 filled in the case 7. The low dielectric constant film 11 is desirably any one of a silicone rubber, a polyimide and an epoxy resin. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008085169(A) 申请公布日期 2008.04.10
申请号 JP20060265178 申请日期 2006.09.28
申请人 MITSUBISHI ELECTRIC CORP 发明人 KAWAGUCHI YASUHITO;HAYASHIDA YUKIMASA
分类号 H01L25/07;H01L25/18 主分类号 H01L25/07
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