Wafer position correction with a dual, side-by-side wafer transfer robot

摘要

Methods and systems for positioning wafers using a dual side-by-side end effector robot are provided. The methods involve performing place moves using dual side-by-side end effector robots with active wafer position correction. According to various embodiments, the methods may be used for placement into a process module, loadlock or other destination by a dual wafer transfer robot. The methods provide nearly double the throughput of a single wafer transfer schemes by transferring two wafers with the same number of moves.

主权项

1. A method of placing wafers in adjacent stations of a multi-station location comprising:
picking first and second wafers from a first location with a dual end effector robot such that each end effector holds a wafer; placing the first wafer at a first station of the multi-station location; and placing the second wafer at a second station of the multi-station location, wherein each of the first and second stations comprise a set of lift pins, wherein each set of lift pins has two masters such that the set is independently controllable by a second controller and by the dual end effector robot and wherein placing each wafer at its station comprises raising lift pins at the station to lift the wafer off the end effector.