发明名称 SPUTTERING METHOD, AND SPUTTERING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a sputtering method and a sputtering device, which are enabled, when a first target and a second target are simultaneously sputtered by applying a high-frequency voltage, to suppress a dispersion in a filming result between the targets.SOLUTION: A phase difference is made between a first phase or the phase of a high-frequency voltage applied to a first target and a second phase or the phase of a high-frequency voltage applied to a second target. At the individuals of a plurality of phase differences different from each other, a sputtering method comprises: an acquiring step of sputtering a first target and a second target simultaneously, thereby to acquire a first characteristic value of the first target in each phase difference and a second characteristic value of the second target in each phase difference; and a filming step of filming a substrate S, after a set value obtained from the result was set as the filming phase difference, when the phase difference at the time when the first characteristic value and the second characteristic value are substantially identical is the set value.SELECTED DRAWING: Figure 1
申请公布号 JP2016211063(A) 申请公布日期 2016.12.15
申请号 JP20150097986 申请日期 2015.05.13
申请人 ULVAC JAPAN LTD 发明人 SASAKI SHUNSUKE;SUZUKI AKIYOSHI;JINBO TAKETO
分类号 C23C14/34 主分类号 C23C14/34
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