ELECTRONIC-COMPONENTS SEALING MOLD, TRANSFER MOLDING MACHINE, AND ELECTRONIC-COMPONENTS SEALING METHOD

摘要

An electronic-components sealing mold 2 is provided with: a lower-mold cavity block 53 for placing a substrate 91 with electronic-components mounted on a surface thereof; an upper-mold cavity holder 23 that vertically moves in conjunction with vertical movement of the lower-mold cavity block 53 and holds the substrate 91 with the lower-mold cavity block 53; an upper-mold chess holder 22 that vertically moves in conjunction with vertical movement of the upper-mold cavity holder 23 and has through-holes; an upper-mold spring 28 that expands/contracts in conjunction with vertical movement of the upper-mold chess holder 22; an upper-mold cavity block 27 that is positioned so as to be vertically movable inside the upper-mold cavity holder 23 and forms a cavity with the lower-mold cavity block 53; and joining members 25 that are inserted in the through-holes of the upper-mold chess holder 22 so as to be slidably movable and fixed to an upper face of the upper-mold cavity block 27. The lower-mold cavity block 53 is provided with a pot part in which a plunger for injecting a molten resin covering front faces of the electronic components into the cavity can be inserted.