| 摘要 |
PURPOSE:To obtain a resin adhesive excellent in adhesion and toughness by incorporating a low-molecular-weight rubber component comprising a styrene block copolymer resin in a one-pack epoxy resin. CONSTITUTION:100 pts.wt. mixture of an epoxy resin (e.g. liquid bisphenol A product) with a latent curing agent (e.g. dicyandiamine) is mixed with 3-30 pts.wt. low-molecular-weight rubber component prepared by heating a styrene block copolymer resin (e.g. SEBS) in the presence of an organic peroxide (e.g. BPO). |
