| 摘要 |
PROBLEM TO BE SOLVED: To improve in-plane uniformity of the machining quantity in a CMP polishing device for polishing machined material of plate shape using a polishing tool of small area compared to a polished surface. SOLUTION: A polishing head 5 is composed of a pressing mechanism part 17, a spindle 9, a driving motor 10 and a ball screw 29 and fitted to the lower side of a turning arm 12 through the ball screw 29. The pressing mechanism part 17 is provided opposedly to a turntable 2, and polishing cloth 20 is mounted on the lower face of the pressing mechanism part 17. The diameter of the effective polishing surface of the polishing cloth 20 is smaller than the diameter of a silicon wafer 1. The polishing head 5 is vertically moved along guide mechanism 8 by driving the ball screw 29 using a servo motor 27. The pressure of an operating fluid supplied to the pressing mechanism part 17 is controlled through a pressure control valve 31 or the like to maintain the pressing force of the polishing cloth 20 to the silicon wafer 1 constant. |
