| 摘要 |
A method for fabricating a semiconductor package is provided to expose an adhesive part of a bonding pad and an adhesive part of a wafer attached to a scribe line by using a WBL(Wafer Backside Lamination) tape. A window is formed at a center of a substrate(105). A bond finger(106) is formed at a lower side of the substrate adjacent to the window. A center pad type semiconductor chip(101) is attached on an upper surface of the substrate by using a WBL tape(103). A metal wire(107) is used for connecting electrically a bonding pad(102) of the semiconductor chip with the bond finger of the substrate. A sealant(108) is used for sealing the upper surface of the substrate including a window region and an upper surface of the center pad type semiconductor chip. Solder balls are attached to a lower surface of the substrate. The WBL tape is used for exposing the bonding pad and is attached to the inside of the substrate. |
