发明名称 Method for controlling plasma density or the distribution thereof
摘要 Method for manufacturing magnetron sputter-coated workpieces includes placing a substrate adjacent a magnetron source having a target cathode, generating above the target cathode, at least one plasma loop by an electron trap established by generating a magnetic field which forms, in top view on the target cathode, a magnet field loop and, viewed in cross-section on the target cathode, a tunnel-shaped arc field and, an electric field which crosses the magnetic field of the magnet field loop. Plasma density distribution above the target cathode is controlled by interacting a control anode with the electron trap in a control segment area of the plasma loop. Magnetron sputter-coating the substrate by the magnetron sputter-source then takes place.
申请公布号 US7368041(B2) 申请公布日期 2008.05.06
申请号 US20040967383 申请日期 2004.10.18
申请人 OC OERLIKON BALZERS AG 发明人 KRASSNITZER SIEGFRIED
分类号 C23C14/35;H01J37/34 主分类号 C23C14/35
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