发明名称 TRANSPARENT CONDUCTIVE FILM FORMING METHOD, AND MANUFACTURING METHOD OF ORGANIC ELECTROLUMINESCENT ELEMENT
摘要 PROBLEM TO BE SOLVED: To solve a problem that, in case a transparent conductive film is formed by a sputtering method, a molecular structure of an organic thin film is destroyed (bond-break) by scattering and collision of recoil Ar ions,γelectrons, target particles or the like which are high-energy particles to degrade a light emission potential that an organic light-emitting material intrinsically has. SOLUTION: In the transparent conductive film forming method providing a mask on a substrate and pattern-forming the transparent conductive film on the substrate by the sputtering method, a trap electrode equipped with a pin made of a magnet is provided between the target and the substrate, and the transparent conductive film made of a target-forming material is pattern-formed on the substrate by the sputtering method. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008027648(A) 申请公布日期 2008.02.07
申请号 JP20060196688 申请日期 2006.07.19
申请人 TOPPAN PRINTING CO LTD 发明人 KURIYA YUTAKA
分类号 H05B33/10;C23C14/34;C23C14/35;H01B13/00;H01L51/50;H05B33/28 主分类号 H05B33/10
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