| 摘要 |
PROBLEM TO BE SOLVED: To provide a maintenance method for a semiconductor element inspecting apparatus, which can carry out a maintenance of the semiconductor element inspecting apparatus with high reliability. SOLUTION: In the method, a resistance measuring probe card 18 to which all terminals t<SB>n</SB>to be connected with terminals T<SB>n</SB>of a test head 6 are connected in common with another, is attached to the test head 6, and then a first resistance value of paths ranging from respective terminals T<SB>2</SB>-T<SB>n</SB>up to terminals t<SB>2</SB>-t<SB>n</SB>which are connected to respective terminals T<SB>2</SB>-T<SB>n</SB>, is measured by a unit 6a which measures a voltage by applying current. In the case that the first resistance value is within an acceptable range, the resistance measuring probe card 18 is replaced with an element inspecting probe card 8, and a probe needle P<SB>n</SB>of the element inspecting probe card 8 is brought to contact with a region 20b of a resistance measurement/probe cleaning-use wafer 20 which has the region 20b where a conductive film is formed. Then, a second resistance value of paths ranging from leading edges of respective probe needles P<SB>2</SB>-P<SB>n</SB>up to the terminals T<SB>2</SB>-T<SB>n</SB>which are connected to respective probe needles P<SB>2</SB>-P<SB>n</SB>, is measured by using the unit 6a. COPYRIGHT: (C)2008,JPO&INPIT
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