| 摘要 |
PROBLEM TO BE SOLVED: To ensure a joining area between a surface mount device and a pad for joining a main body section by preventing the outflow of a binder (such as cream solder) from a through-hole while forming the through-hole to the pad for joining the main body section joining the surface mount device. SOLUTION: A printed board 3 has the pads 5 for joining the main body section joining the main body section of the surface mount device 2 and the pads 6 for joining leads joining the leads 2c extended from the surface mount device 2 in the periphery of the pads 5 for joining the main body section. The through-holes 7 are formed to the pads 5 for joining the main body section, and resists 8 are fitted around the through-holes 7 on the pad surfaces of the pads 5 for joining the main body section. The resists 8 function as weirs in soldering, and the outflow from the through-holes 7 of cream solder is prevented. COPYRIGHT: (C)2008,JPO&INPIT
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