发明名称 CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste capable of screen-printing and suitable for filling through-holes or via-holes of printed wiring boards, accomplishing high-reliability electric connection and low resistance. SOLUTION: The conductive paste contains, as essential components, copper powder, metal salt, polyols, epoxy resin, and imidazoles. The metal salt is at least one kind of compound containing silver or copper as a component. Preferably, the metal salt is at least one selected from organic acid salts and metal complexes. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008226727(A) 申请公布日期 2008.09.25
申请号 JP20070065613 申请日期 2007.03.14
申请人 SUMITOMO BAKELITE CO LTD 发明人 OKADA WATARU
分类号 H01B1/22 主分类号 H01B1/22
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