| 摘要 |
A connection of an RF chip (1) comprising pads (2; 2') is established by connecting said pads (2; 2') to substrate and strip conductors in an opening (10a; 10f) of a laminate. The connection to the strip conductors (3, 31) integrated into the substrate (4) is established via the chip pads (2). Once the connection has been established, the opening (10, 10', 10f) comprising the chip and the pads is filled with a sealing material that increases the compressive strength of the entire chip module. Preferably, the strip conductor structures are formed once the connection process of the chip (1) has been completed, thus significantly improving the cost efficiency and quality of the chip, simplifying the production processes, and optimizing a permanent safe connection between the chip and the strip conductors. Said connections can also be perfectly used in tough environments, e.g. in laundries. |
