Air bridge structure having dielectric coating

摘要

A substrate having an air bridge structure with end portions disposed and supported on the substrate and an elevated portion disposed between the end portions is coated with a protective layer. The protective layer is patterned to: leave portions of the protective layer over elevated portion and at least over the end portions of a region under the elevated portion of the air bridge structure; and remove portions over adjacent portions of the substrate. A dielectric material having a thickness greater than the height of the air bridge structure is deposited over the patterned protective layer portions remaining over elevated portion and over the adjacent portions of the substrate, the patterned temporary coating preventing the dielectric material from passing into the region under the elevated portion of the air bridge structure. The dielectric material is patterned to remove portions of the dielectric material over the patterned protective layer remaining over elevated portion while leaving the dielectric material over the adjacent portions of the substrate. The patterned protective layer portions remaining over elevated portion are removed while leaving the dielectric material over the adjacent portions of the substrate.

主权项

1. A method for forming an air bridge, comprising:
providing a structure comprising a substrate having a metal air bridge structure, the metal air bridge structure having end portions disposed and supported on the substrate and an elevated portion of the metal air bridge structure disposed between the end portions and suspended over the substrate; coating the provided structure with a temporary protective layer; patterning the temporary protective layer to leave portions of the temporary protective layer over the elevated portion of the metal air bridge structure and at least over the end portions of a region under the elevated portion of the metal air bridge structure while removing portions of the temporary protective layer over adjacent portions of the substrate; depositing a dielectric material over the patterned temporary protective layer portions remaining over the elevated portion of the metal air bridge structure and over the adjacent portions of the substrate; patterning the dielectric material to remove portions of the dielectric material over the patterned temporary protective layer remaining over the elevated portion of the metal air bridge structure while leaving the dielectric material over the adjacent portions of the substrate; removing the patterned temporary protective layer portions remaining over the elevated portion of the metal air bridge structure and over the region under the elevated portion of the metal air bridge structure while leaving the dielectric material over the adjacent portions of the substrate.