| 发明名称 |
Shielded device packages having antennas and related fabrication methods |
| 摘要 |
Shielded device packages and related fabrication methods are provided. An exemplary device package includes one or more electrical components, a molding compound overlying the one or more electrical components, a conductive interconnect structure within the molding compound, a conductive frame structure laterally surrounding the one or more electrical components and the interconnect structure, and a shielding structure overlying the one or more electrical components. The shielding structure is electrically connected to the frame structure and at least a portion of the molding compound resides between the shielding structure and the one or more electrical components. |
| 申请公布号 |
US9362234(B2) |
申请公布日期 |
2016.06.07 |
| 申请号 |
US201414149335 |
申请日期 |
2014.01.07 |
| 申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
Pabst Eduard J.;Pacheco Sergio P.;Yap Weng F. |
| 分类号 |
H01L23/552;H01L21/00;H01L21/768;H01L23/31;H01L23/00;H01L23/66;H01L23/498;H01L23/538;H01L21/56 |
主分类号 |
H01L23/552 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device package comprising:
one or more electrical components; a molding compound overlying the one or more electrical components; a conductive interconnect structure within the molding compound; a conductive frame structure laterally surrounding the one or more electrical components and the interconnect structure; and a shielding structure overlying the one or more electrical components, wherein: the shielding structure is electrically connected to the frame structure; at least a portion of the molding compound resides between the shielding structure and the one or more electrical components; the shielding structure contacts a first surface of the frame structure; and the first surface of the frame structure is aligned with a second surface of the portion of the molding compound. |
| 地址 |
Austin TX US |
