Apparatus and method for embedding components in small-form-factor, system-on-packages

摘要

According to various aspects of the present disclosure, an apparatus is disclosed that includes a small form factor mobile platform including a system-on-package architecture, the system-on-package architecture arranged as a stack of layers including: a first layer having a first conformable material; a second layer having a second conformable material; a third layer having a third material; and one or more electronic components embedded within the stack of layers, wherein the first conformable material, the second conformable material, or both are configured to allow high frequency signal routing.

主权项

1. An apparatus comprising:
a platform arranged as a stack of layers comprising: a first layer of the stack of layers composed of a first conformable material; a second layer of the stack of layers composed of a second conformable material and a third material including a polymer, wherein at least a portion of the second conformable material and at least a portion of the third material are in direct surface contact with at least a portion of the first layer, wherein the second conformable material is different than the third material; and one or more electronic components embedded within the stack of layers, wherein at least one of the one or more electronic components is arranged within the first conformable material and the second conformable material, and adjacent to the third material, wherein the first conformable material, the second conformable material, or both are configured to allow signal distribution.