Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages

摘要

Methods for forming semiconductor device packages include applying a photoimageable dielectric adhesive material to a major surface of a semiconductor die and at least partially over conductive elements on the semiconductor die. The photoimageable dielectric adhesive material may be removed from over the conductive elements. The conductive elements are aligned with and bonded to bond pads of a substrate, and the semiconductor die and the substrate are adhered with the photoimageable dielectric adhesive material. A semiconductor device package includes at least one semiconductor die including conductive structures thereon, a substrate including bond pads thereon that are physically and electrically connected to the conductive structures, and a developed photoimageable dielectric adhesive material disposed between the semiconductor die and the substrate around and between adjacent conductive structures.

主权项

1. A method for forming a semiconductor device package, the method comprising:
applying a first photoimageable dielectric adhesive material to a major surface of a semiconductor die and at least partially over conductive elements protruding from the major surface of the semiconductor die; removing the first photoimageable dielectric adhesive material from over the conductive elements; applying a second photoimageable dielectric adhesive material to a major surface of a substrate and at least partially over bond pads of the substrate; removing the second photoimageable dielectric adhesive material from over the bond pads of the substrate; respectively aligning the conductive elements of the semiconductor die with bond pads of the substrate; bonding the conductive elements of the semiconductor die with the bond pads of the substrate to physically and electrically couple the conductive elements with the bond pads; and adhering the semiconductor die to the substrate with the first photoimageable dielectric adhesive material and the second photoimageable dielectric adhesive material.