发明名称 |
Methods of forming oxide thin film and electrical devices and thin film transistors using the methods |
摘要 |
Provided are a method of forming an oxide thin film and an electrical device and thin film transistor using the method. The method includes forming an oxide thin film on a substrate by applying a precursor solution; and performing a thermal treatment process on the substrate under a pressurized atmosphere using a gas at about 100° C. to about 400° C. |
申请公布号 |
US9362116(B2) |
申请公布日期 |
2016.06.07 |
申请号 |
US201114127690 |
申请日期 |
2011.11.22 |
申请人 |
Indystry-Academic Cooperation Foundation, Yonsei University |
发明人 |
Kim Hyun Jae;Shin Hyun Soo;Rim You Seung |
分类号 |
H01L21/00;H01L23/58;H01L21/02;H01L29/24;H01L29/49;H01L29/66;H01L29/786 |
主分类号 |
H01L21/00 |
代理机构 |
Carter, DeLuca, Farrell & Schmit, LLP |
代理人 |
Carter, DeLuca, Farrell & Schmit, LLP |
主权项 |
1. A method of forming an oxide thin film, comprising:
forming an oxide thin film on a substrate by applying a precursor solution through a solution process method; and performing a pressurized thermal treatment process under a pressurized atmosphere using a gas at about 100° C. to about 400° C., wherein during the performing of the pressurized thermal treatment process, the pressurized atmosphere is a pressure condition of about 5 bar to about 20 bar. |
地址 |
Seoul KR |