发明名称 Methods of forming oxide thin film and electrical devices and thin film transistors using the methods
摘要 Provided are a method of forming an oxide thin film and an electrical device and thin film transistor using the method. The method includes forming an oxide thin film on a substrate by applying a precursor solution; and performing a thermal treatment process on the substrate under a pressurized atmosphere using a gas at about 100° C. to about 400° C.
申请公布号 US9362116(B2) 申请公布日期 2016.06.07
申请号 US201114127690 申请日期 2011.11.22
申请人 Indystry-Academic Cooperation Foundation, Yonsei University 发明人 Kim Hyun Jae;Shin Hyun Soo;Rim You Seung
分类号 H01L21/00;H01L23/58;H01L21/02;H01L29/24;H01L29/49;H01L29/66;H01L29/786 主分类号 H01L21/00
代理机构 Carter, DeLuca, Farrell & Schmit, LLP 代理人 Carter, DeLuca, Farrell & Schmit, LLP
主权项 1. A method of forming an oxide thin film, comprising: forming an oxide thin film on a substrate by applying a precursor solution through a solution process method; and performing a pressurized thermal treatment process under a pressurized atmosphere using a gas at about 100° C. to about 400° C., wherein during the performing of the pressurized thermal treatment process, the pressurized atmosphere is a pressure condition of about 5 bar to about 20 bar.
地址 Seoul KR