Memory module and memory system

摘要

A memory module is provided which includes a printed circuit board; first semiconductor packages provided on one surface of the printed circuit board; and second semiconductor packages provided on the other surface of the printed circuit board, the first semiconductor packages and the second semiconductor packages having semiconductor dies that form ranks. A number of the ranks formed by the first semiconductor packages being different from a number of the ranks formed by the second semiconductor packages. Semiconductor packages forming a same one of the ranks receive a chip selection signal in common and semiconductor packages forming other ranks receive a different chip selection signal.

主权项

1. A memory system comprising:
a memory controller; and a plurality of first semiconductor dies connected with the memory controller through a common channel and configured to operate in response to control signals from the memory controller, wherein
the plurality of first semiconductor dies form ranks a number of which is not a power of two, andsemiconductor dies of the plurality of first semiconductor dies in a same rank receive a chip selection signal in common and semiconductor in different ranks receive different chip selection signals.