SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

Disclosed are a semiconductor package and a method for manufacturing the same. The semiconductor package according to the embodiment of the present invention includes a semiconductor chip; a wiring unit including a wiring layer which is electrically connected to a signal pad of the semiconductor chip, and an insulating layer which insulates the wiring layer; a sealing member which molds the semiconductor chip and the wiring unit, and surrounds the semiconductor chip and a lateral part of the wiring unit; and an external connection terminal which is mounted on a surface facing a surface where the semiconductor chip of the wiring unit is located, and is electrically connected to the wiring layer. So, the structural stability of the semiconductor package can be improved.