| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is made into wafer level CSP and has a structure in which incidence of light from other than a prescribed light incident face is suppressed and malfunction of a loaded integrated circuit or device is not caused by an electromagnetic wave of an infrared to ultraviolet region, and to provide a method of manufacturing the semiconductor device and an electronic component using the semiconductor device. <P>SOLUTION: The semiconductor device 10 includes a structure 11 having a substrate 2 which has an electrode 3 on one face and is formed of semiconductor, an insulating part 4 arranged on one face of the substrate and a first protection part 6 disposed on the other face of the substrate. The semiconductor device 10 has a second protection part 7 covering part of or a whole part of the structure. The first protection part and the second protection part have shielding property. <P>COPYRIGHT: (C)2008,JPO&INPIT |
