SEMICONDUCTOR PACKAGE AND SOLDER PACKAGING METHOD

摘要

PROBLEM TO BE SOLVED: To reduce stress occurring in solder balls for joining substrates.SOLUTION: A semiconductor package includes: a first substrate on which a semiconductor chip is mounted; solder balls formed on the first substrate; and pins inserted into through holes penetrating through the second substrate which is disposed facing the first substrate. The pins are joined to the solder balls.SELECTED DRAWING: Figure 1