Stacked IC control through the use of homogenous region

摘要

A package includes a semiconductor chip. The semiconductor chip includes a substrate, a plurality of dielectric layers underlying the substrate, a dielectric region penetrating through the plurality of dielectric layers, and a metal pad overlapped by the dielectric region. A conductive plug penetrates through the substrate, the dielectric region, and the metal pad.

主权项

1. A package comprising:
a first semiconductor chip including:
a first substrate;a first plurality of dielectric layers underlying the first substrate;a dielectric region penetrating through the first plurality of dielectric layers; anda first metal pad overlapped by the dielectric region; and a conductive plug penetrating through the first substrate, the dielectric region, and the first metal pad, wherein an entirety of the dielectric region is underlying the first substrate.