Enhanced flip chip structure using copper column interconnect

摘要

A flip chip package includes: a carrier coupled to a die. The carrier includes: at least a via, for coupling the surface of the carrier to electrical traces in the carrier; and at least a capture pad electrically coupled to the via, wherein the capture pad is plated over the via. The die includes: at least a bond pad formed on the surface of the die; and at least a copper column, formed on the bond pad for coupling the die to the capture pad on the carrier, wherein part of the copper column overhangs the via opening.

主权项

1. A flip chip package comprising:
a carrier, comprising:
at least a via, for coupling the surface of the carrier to electrical traces in the carrier, wherein the via is open and unfilled; andat least a capture pad electrically coupled to the via, wherein the capture pad is plated over the via; and a die, coupled to the carrier, comprising:
at least a bond pad formed on the surface of the die; andat least a copper column, formed on the bond pad for coupling the die to the capture pad on the carrier, wherein part of the copper column overhangs the via opening and part of the copper column does not overhang the via opening, so that only part of the via opening is covered by the copper column.