Chip-embedded packages with backside die connection

摘要

A semiconductor package includes a semiconductor die and a metal clip. In one embodiment, the semiconductor die is embedded in an insulating material and has a first surface facing in a first direction, a second surface facing in a second direction opposite the first direction and an edge extending between the first and second surfaces. The metal clip is embedded in the insulating material above the die and bonded to the second surface of the die. Part of the metal clip extends laterally beyond the edge of the die and vertically in the first direction to provide galvanic redistribution at the second surface of the die. Other embodiments of semiconductor packages are also provided.

主权项

1. A semiconductor package, comprising:
a semiconductor die embedded in an insulating material, the die having a first surface facing in a first direction, a second surface facing in a second direction opposite the first direction and an edge extending between the first and second surfaces; a structured metal redistribution layer disposed in the insulating material below the die; and a metal clip embedded in the insulating material above the die and bonded to the second surface of the die, wherein part of the metal clip extends laterally beyond the edge of the die and vertically in the first direction to provide galvanic redistribution at the second surface of the die, wherein the structured metal redistribution layer is connected to terminals at the first surface of the die and connected to the part of the metal clip that extends laterally beyond the edge of the die and vertically in the first direction toward the structured metal redistribution layer.