| 发明名称 |
LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE COMPOSITION |
| 摘要 |
This invention claims low application temperature hot melt adhesive compositions including at least about 15% by weight of a first styrene block copolymer with a melt flow rate of at least about 15 g/10 minutes (190° C., 2.16 kgs) and a diblock content of no greater than about 10% by weight. |
| 申请公布号 |
US2016272856(A1) |
申请公布日期 |
2016.09.22 |
| 申请号 |
US201615071959 |
申请日期 |
2016.03.16 |
| 申请人 |
H.B. Fuller Company |
发明人 |
Mansour Ameara S.;Davis Kevin P.;Malcolm David B.;Kroll Mark S.;Vaughan Steven R.;Roska Timothy W. |
| 分类号 |
C09J153/02;A61L15/58;C09J7/02;A61L15/24 |
主分类号 |
C09J153/02 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. A hot melt adhesive composition comprising:
at least about 15% by weight of a first styrene block copolymer having an unsaturated midblock, a melt flow rate of at least about 15 g/10 minutes (190° C., 2.16 kgs) and a diblock content of no greater than about 10% by weight, the hot melt adhesive composition having a viscosity of no greater than about 15,000 cps at 121° C. |
| 地址 |
St. Paul MN US |
